JPH0122732B2 - - Google Patents

Info

Publication number
JPH0122732B2
JPH0122732B2 JP58106935A JP10693583A JPH0122732B2 JP H0122732 B2 JPH0122732 B2 JP H0122732B2 JP 58106935 A JP58106935 A JP 58106935A JP 10693583 A JP10693583 A JP 10693583A JP H0122732 B2 JPH0122732 B2 JP H0122732B2
Authority
JP
Japan
Prior art keywords
mold
plate
ejector
lower mold
surface plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58106935A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59231823A (ja
Inventor
Hiromichi Yamada
Koji Yanagya
Kunio Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10693583A priority Critical patent/JPS59231823A/ja
Publication of JPS59231823A publication Critical patent/JPS59231823A/ja
Publication of JPH0122732B2 publication Critical patent/JPH0122732B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles
    • B29C45/4005Ejector constructions; Ejector operating mechanisms

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10693583A 1983-06-13 1983-06-13 半導体装置の樹脂封止成形装置 Granted JPS59231823A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10693583A JPS59231823A (ja) 1983-06-13 1983-06-13 半導体装置の樹脂封止成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10693583A JPS59231823A (ja) 1983-06-13 1983-06-13 半導体装置の樹脂封止成形装置

Publications (2)

Publication Number Publication Date
JPS59231823A JPS59231823A (ja) 1984-12-26
JPH0122732B2 true JPH0122732B2 (en]) 1989-04-27

Family

ID=14446248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10693583A Granted JPS59231823A (ja) 1983-06-13 1983-06-13 半導体装置の樹脂封止成形装置

Country Status (1)

Country Link
JP (1) JPS59231823A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATA50696A (de) * 1996-03-19 1997-07-15 Engel Gmbh Maschbau Spritzgiessmaschine
AU2002212030A1 (en) * 2000-11-14 2002-05-27 Netstal-Maschinen Ag Method and device for the ejection of injection moulded pieces

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575338A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Molding die

Also Published As

Publication number Publication date
JPS59231823A (ja) 1984-12-26

Similar Documents

Publication Publication Date Title
US4599062A (en) Encapsulation molding apparatus
TW201701371A (zh) 電子零件密封模具、轉移成形機及電子零件密封方法
KR20010012976A (ko) 반도체 장치의 제조 방법, 반도체 장치의 몰드 장치 및반도체 장치
JPS6233317Y2 (en])
US5366368A (en) Multi-plunger manual transfer mold die
JP2001047458A (ja) 樹脂封止装置
JPH0122732B2 (en])
JPH09220739A (ja) モールド装置
KR102078722B1 (ko) 반도체 패키지 제조 장치
JP2001096588A (ja) 射出成形用型締装置
US5169586A (en) Method of manufacturing resin-sealed type semiconductor device
JPS6235630A (ja) 樹脂封止形半導体装置成形用モ−ルド金型
JPH0713985B2 (ja) 半導体装置の樹脂封止成形装置
JPS6097815A (ja) 成形方法および成形機
JP3408599B2 (ja) トランスファモールド装置
US5480296A (en) Transfer molding apparatus for encapsulating an electrical element in resin
JPS6366051B2 (en])
JPS59110124A (ja) レジンモ−ルド装置
JPH0342982Y2 (en])
JPS635227Y2 (en])
JPH06143379A (ja) 樹脂成形機における異物検出方法
JPS6392032A (ja) 半導体装置の樹脂封止装置
JP2544146Y2 (ja) フラットパッケージ型半導体製品用の樹脂封止成形装置
JP2538730Y2 (ja) 樹脂モールド装置
JPS6258657B2 (en])