JPH0122732B2 - - Google Patents
Info
- Publication number
- JPH0122732B2 JPH0122732B2 JP58106935A JP10693583A JPH0122732B2 JP H0122732 B2 JPH0122732 B2 JP H0122732B2 JP 58106935 A JP58106935 A JP 58106935A JP 10693583 A JP10693583 A JP 10693583A JP H0122732 B2 JPH0122732 B2 JP H0122732B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plate
- ejector
- lower mold
- surface plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10693583A JPS59231823A (ja) | 1983-06-13 | 1983-06-13 | 半導体装置の樹脂封止成形装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10693583A JPS59231823A (ja) | 1983-06-13 | 1983-06-13 | 半導体装置の樹脂封止成形装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59231823A JPS59231823A (ja) | 1984-12-26 |
JPH0122732B2 true JPH0122732B2 (en]) | 1989-04-27 |
Family
ID=14446248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10693583A Granted JPS59231823A (ja) | 1983-06-13 | 1983-06-13 | 半導体装置の樹脂封止成形装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59231823A (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATA50696A (de) * | 1996-03-19 | 1997-07-15 | Engel Gmbh Maschbau | Spritzgiessmaschine |
AU2002212030A1 (en) * | 2000-11-14 | 2002-05-27 | Netstal-Maschinen Ag | Method and device for the ejection of injection moulded pieces |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS575338A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Molding die |
-
1983
- 1983-06-13 JP JP10693583A patent/JPS59231823A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59231823A (ja) | 1984-12-26 |
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